A better transition layer material was confirmed,which overcame the problem of fragmentation and lamination of PDC.
确定了一种效果较好的过渡层,较好地解决了金刚石/硬质合金复合片碎裂及分层的问题。
The fragmentation influences the char combustion behavior in a fluidized bed combustor.
利用下行气流振动床代替流化床 ,研究了煤的碎裂特性 。
Based on the perturbative QCD predictions of gluonic distributions and branch cross section of the J/(?) decay via hadronic, electromagnetic,and radiative channels, the strict solutions of LUND area law of string fragmentation had-ronization are used to treat nonperturbative hadronic production processes, a possible description and Monte Carlo packet for the J/(?) hadronic decay are obtained.
基于微扰QCD所预言的J/ψ衰变道胶子分布及其分支截面和LUND弦碎裂模型强子化面积定律的严格解,得到J/ψ所有衰变模式的微扰和非微扰过程的一种可能的描述,相应的Monte Carlo产生器LUARLW所作的初步模拟结果与BES获取的J/ψ数据的多种带电粒子谱分布和事例形状拓扑分布符合较好。
An Analysis on Break of Separating Ring for Horizontal Concasting and Improved Measures;
水平连铸分离环碎裂的分析和改进措施
The results show that the fracture process of weathering is a fractal one.
因此,分形维至少有2个数值,一为结晶颗粒粒度分形维,一为碎裂颗粒粒度分形维。
Failures of IC smart cards,caused by fracture of thin/ultra-thin Si chip,break of wire bonding or ESD etc.
分析研究了IC智能卡芯片碎裂、引线键合断裂、静电放电损伤等失效模式和失效机理,并结合IC卡制造工艺和失效IC卡的分析实例,对引起这些失效的根本原因作了深入探讨,就提升制造成品率、改善可靠性提出应对措施。
The fracture of thin/ultra-thin silicon dies accounts for half of the failures of IC cards,and its failure modes and failure mechanism are not well understood then.
薄/超薄芯片的碎裂占据IC卡早期失效的一半以上,其失效模式、失效机理亟待深入研究。