Synthesis of UV Photosensitive Prepolymer for Build-up Multilayer Board;
积层电路板用UV感光预聚物的合成
Beneficial effects of cold-moist stratification on seed germination be- haviors of Abies pindrow and Picea smithiana;
冷湿层积法对印度冷杉(Abies pindrow)和长叶云杉(Piceasmithiana)种子萌发的影响(英文)
Effect of Stratification and Hastening Germination on Seedling Emergence and Height of Corylus heterophylla Fisch;
平榛种子层积催芽的试验研究
Changes in Isoperoxidase Patterns of Dovetree Davidia involucrata Seeds During Stratification;
珙桐种子层积期间过氧化物酶同工酶的变化
Study on the Photocurable System of Epoxy Acrylate Resin and the Photoimageable Ink for Build-up Multilayer Printed Circuit Board;
环氧丙烯酸酯光固化体系及积层电路板用感光成像油墨的研究
interlayer contact
层间接触-印制电路板的
interlayer continuity
层间连接-印制电路板的
copper foil laminate
铜箔叠层板-印制电路板的
Experimental Investigation into Deposition Uniformity of Laminated Template Electrodeposition
叠层模板电沉积中沉积均匀性的实验研究
multilayer and high density fine-pitch printed circuit board
多层和高密度细线距的印刷电路板；多层和高密度细线距的线路板
integrator circuit
积分器电路，积分电路
Metal Parts Manufactured by Laminated Template Electrodeposition
采用叠层模板电沉积工艺制备金属零件
EMI Reduction for Power Bus Structures in PCBs Using Magnetic Material Coating
印刷电路板供电系磁性材料涂层的应用
Analysis of the Flaw of Electric Charges Accumulation between Alignment Layer and Liquid Cystal Layer of Liquid Crystal Cell
液晶面板取向层与液晶层界面的电荷累积效应分析
Kingboard Laminates Limited
建滔积层板有限公司
Nam Hing Industrial Laminate Limited
南兴积层板有限公司
Phenolic cellulose paper copper-clad laminated sheets for printed circuits
GB/T4723-1992印制电路用覆铜箔酚醛纸层压板
General rules for copper-clad laminated sheets for printed circuits
GB/T4721-1992印制电路用覆铜箔层压板通用规则
Epoxide cellulose paper copper-clad laminated sheets for printed circuits
GB/T4724-1992印制电路用覆铜箔环氧纸层压板
Test methods for copper-clad laminated sheets for printed circuits
GB/T4722-1992印制电路用覆铜箔层压板试验方法
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板
Low Cost Printed Flexible Multilayer Substrates
多层柔性衬底电路板的低成本丝网印刷