The deeper structure appears to be a gently warped monocline.
较深构造仿佛是轻度翘曲的单斜。
Experimental Research and FEM Simulation of the Slab Head Bending;
轧件头部翘曲的实验研究与数值模拟
Effects of process parameters on the warpage of gas assisted injection molded part
工艺参数对气辅注射制品翘曲的影响
Finite element simulation analysis on warpage after solidifying process of PBGA
PBGA固化后产生翘曲的有限元模拟分析
THE OPTMZATON OF NJECTON PROCESS AND THE ESTMATON OF AVERAGE VALUE BASED ON THE WARP
基于翘曲的注塑工艺优化与均值估计
Radial Deviation - A Matter of Moulding and Curing
盘片径向翘曲的原因:注塑成型和高温固化
Simulation for Lead-free Solder in the Reflow Welding of PCB Warpage Deformation;
无铅钎料在PCB再流焊中翘曲的模拟仿真
Analysis of the Coilset about the Rolls of the Tension Leveller
拉矫带钢纵向翘曲的影响因素仿真分析
warping coefficient
(混凝土路面的)翘曲系数
The condition of having an arched surface.
翘曲表面弯曲的这种状况
Topology Optimization of Beam Cross Section Considering Warping Deformation;
考虑翘曲变形的梁截面拓扑优化设计
Study on Warpage of Injection Products Based on CAE;
基于CAE技术的注塑制品翘曲变形研究
Optimization of warpage for package-on-package (PoP) assembly based on Taguchi method
基于Taguchi实验设计方法优化PoP的翘曲
Most Effective Factors Affecting Warpage of Injection Molded Parts
注塑制品翘曲变形的最显著影响因素
A Simulation-Based Research on the Optimization Methodology for Injection Warp Parameters;
基于仿真的注塑翘曲参数优化方法的研究
Application of regression analysis on warped forecast of plastic parts by using matlab
基于Matlab的回归分析在注塑翘曲预测中的应用
Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate
基于埋置式基板的三维多芯片组件的翘曲研究
Twisting arises in boards through the presence of spiral or interlocking grain.
翘曲多发生在螺旋或交错纹理的板材中。