With Zn-based alloy as filler metal,a fluxless soldering method for joining Al foams with porosities of 74.
6%不同孔隙率的泡沫铝采用无钎剂钎焊方法进行连接实验。
A method for measuring wetting angle of solder;
一种软钎焊料润湿角的测量方法
Soldering Between Ceramic Substrate(Al_2O_3)and Metal Titanium Carrier;
钛板与陶瓷板(Al_2O_3)的软钎焊
Laser soldering technology has been found an important application in micro-electronic joining and packaging.
激光软钎焊技术在微电子焊接和封装方面具有重要的应用价值。
An influence of solder compositions, soldering temperature,flux on solder's flowing property of has been concluded.
对多种锡铅焊料进行一系列不同条件下的漫流性试验 ,分析它们在铜表面上的铺展状况 ,最后归纳出焊料成分、钎焊温度、助焊剂对软钎焊料漫流性影响的规律。
INTERFACIAL STRUCTURE AND MECHANICAL PROPERTIES OF ALUMINIUM FOAM JOINTS FLUXLESS-SOLDERED WITH Zn-Al-Cu BASE ALLOY
Zn-Al-Cu基合金无钎剂钎焊泡沫铝的界面结构及力学性能
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;
Sn-9Zn无铅电子钎料新型助焊剂研究
Investigation on fluxes for Sn-Zn-Al lead-free solder
Sn-Zn-Al无铅钎料的助焊剂研究
Study on the new type soldering acid and filler metal for restoration of ancient bronze;
古代青铜器修复钎焊用钎剂与钎料的改性研究
Research on the New Lead-Free Solder Processing Properties of Brazing and Mechanical Properties;
新型无铅钎料钎焊工艺性及机械性能的研究
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
SnAgCu系无铅钎料合金力学性能及钎焊性能研究
electric brazing
电加热钎焊;电热钎焊;电热铜焊;电热硬钎焊
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
Thermomechanical Fatigue Properties of Lead-Free Solder Joints;
无铅合金钎焊接头热疲劳性能的研究
Duality of Influence of Flux on Brazing Property Between Aluminum Alloys and Stainless Steel in Air
钎剂对铝合金与不锈钢大气钎焊性影响的二重性
This paper introduces the connection using the brazing technique, selects corresponding brazing filler metal and flux together with proper technology, and determines the techniques and measures.
介绍了采用钎焊的方法进行连接;选择了相应的钎料与钎剂;并确定了工艺及措施。
Research on the Liquid Structure of Lead-free Solders and the Interfacial Reaction during Soldering and Their Correlation;
无铅钎料的液态结构与钎焊界面反应及其相关性研究
Microstructure and Performance of Sn-9Zn Based Lead Free Solder/Cu Solder Joint and Their Interface Region
Sn-9Zn基无铅钎料/Cu钎焊接头及界面区组织性能的研究
Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比
Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;
基于Sn-Pb-Zn钎料铝合金钎焊工艺研究