This paper describes the development background,kinds,required characleristic,processes and future theme of Pb-free solder plating.
概述了无铅焊料镀层的开发背景、种类、要求的特性、工艺和今后的课题。
Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Cu lead-free solder alloy;
稀土Er对Sn-3.0Ag-0.5Cu无铅焊料合金组织与性能的影响
Effect of cerium on the structure and properties of Sn-Ag-Cu lead-free solder;
Ce对SnAgCu系无铅焊料合金组织和性能的影响
Properties of Sn-Zn alloys as lead-free solders;
亚共晶Sn-Zn系合金无铅焊料的性能
RoHS law endorsed by EU on electronic products quickens the tendency of lead-free solders.
文章对无铅焊料的发展过程,Sn-Ag-Cu合金的性能进行了综述,重点介绍了Sn-Ag-Cu焊点的可靠性,包括试验法和有限元法。
Recently,lead-free solders are replacing Sn-Pb solders because of human health and the environmental protection and legal regulation worldwide.
近年来环境和人类健康保护的要求和有关国际法规的压力使世界电子工业面临以无铅焊料代替传统锡铅焊料的迫切需求。
Study of the Reliability of Power Device with Lead-free Heat-sink Attachment;
功率器件无铅焊料焊接层可靠性研究
Properties of Sn-3.0Ag-0.5Cu-xNi lead-free solders and soldering joints
Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能
The Research of Sn-Zn System without Ag Lead-free Solder
新型Sn-Cu系无银无铅焊料的研究
Investigation on Fabrication of a Low Melting Point Lead-free Sn-Bi-X Solders and Lead-free Soldering Process;
低熔点无铅焊料Sn-Bi-X的研制与无铅焊接工艺研究
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
The Microstructure and Mechanical Property of Lead-free Solder/copper Single Crystal Interface;
铜单晶体/无铅焊料的界面组织与性能
The Influence with the Trace Content of Ni & Re for Sn0.7Cu Lead-Free Solder;
微量Ni、Re对Sn0.7Cu无铅焊料性能的影响
Study on Indentation Creep Behavior of the Sn-Ag-Bi Lead-free Solder;
Sn-Ag-Bi无铅焊料压入蠕变性能的研究
Study on Particle Reinforced Sn3.8Ag0.7Cu Composite Lead Free Solders
颗粒增强Sn3.8Ag0.7Cu复合无铅焊料的研究
Low Temperature Lead-free Solder and its Developing Tendency
Sn-Bi系列低温无铅焊料及其发展趋势
Effects of oxidation on wettability of Sn-Zn alloys
氧化对Sn-Zn系无铅焊料润湿性的影响
SnAgCuBi-Solder Alloy Development and Its Joint Interfacial Behavior Study;
SnAgCuBi系无铅焊料的开发及其焊点界面行为的研究
Impact of Lead-Free Solder on the Result of Soldering Resistance Test
采用无铅焊料对测覆铜板耐浸焊结果的影响
Separation and Controlling of Intermetallic Compounds in Lead-free Sn-Ag Solders;
Sn-Ag系无铅焊料中金属间化合物的形成与控制
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究