Evolution of Wafer-Surface Preparation for Semiconductor Industry;
半导体产业中晶圆片表面处理的发展
The structural design of the wafer expansion device was put forward.
该装置可完成片盒、内圈和外圈的输入和取片动作,实现扩晶过程张紧力的调节控制、分离晶圆和衬架、排出空片盒和废弃的衬架等。
We present a FEM method for forecasting the suitable pressure on the retaining ring,which is critical in manufacturing good quality wafers.
随着晶圆直径的增加,在CMP加工过程中,晶圆边缘容易出现"过磨(over-grinding)"现象,降低了平坦度和晶圆利用率。
According to the characteristics,the modeling problem using Petri net for cluster tools in wafer fabrication was studied.
晶圆加工过程中使用的模块化组合设备具有可重构性,设备配置的复杂程度由晶圆加工工艺方案决定,针对这一特点,研究了晶圆加工系统的Petri网建模问题。
IC testing can be sorted by Wafer probing and Finial testing, their main function is to inspect the defective IC, which is in wafer fabrication, and then find out the root cause among the defective IC.
IC测试主要分为晶圆针测以及成品测试，其主要功能为检测出IC在制造过程中所发生的瑕疵并找出其中根本原因，以确保产品良率正常及提供测试资料作为IC设计及IC制造分析之用。