metal base(core) copper clad laminate

基本解释金属基(芯)覆铜箔板

网络释义

1)metal base(core) copper clad laminate,金属基(芯)覆铜箔板2)metal core copper-clad laminate,金属芯覆铜箔层压板3)metal base copper clad laminate,金属基覆铜板4)copper base copper clad laminate,铜基覆铜箔板5)ceramics base copper-clad laminates,陶瓷基覆铜箔板6)printed circuit board,覆铜箔板

用法和例句

White copper clad laminate and metal base copper clad laminate made from the film were used in LED base material.

这种薄膜在制成白色覆铜板及金属基覆铜板后,在LED基板制造中得到了应用。

The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.

介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。

It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.

本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。

metal core copper-clad laminate

金属芯覆铜箔层压板

Phenolic cellulose paper copper-clad laminated sheets for printed circuits

GB/T4723-1992印制电路用覆铜箔酚醛纸层压板

General rules for copper-clad laminated sheets for printed circuits

GB/T4721-1992印制电路用覆铜箔层压板通用规则

Epoxide cellulose paper copper-clad laminated sheets for printed circuits

GB/T4724-1992印制电路用覆铜箔环氧纸层压板

Test methods for copper-clad laminated sheets for printed circuits

GB/T4722-1992印制电路用覆铜箔层压板试验方法

Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板

The Synthesis and Properties of Epoxy Resins Used in Copper Clad Laminates;

覆铜箔层压板专用环氧树脂的合成与性能

New Generation High Heat Resistance,High Modulus and Low CTE Copper Clad Laminates

新一代高耐热性、高模量、低CTE覆铜箔层压板材料

" Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards"

GB/T12630-1990一般用途的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)

foil-mounting board

金属箔纸层合用纸板

Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits

GB/T16315-1996印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板

This paper introduces a new technics of producing light colour phenolic paper copper-clad laminate and summarizes the main effects on the laminates colour.

本文介绍了一种生产浅色覆铜箔酚醛纸层压板的工艺,总结了影响层压板颜色的因素。

Application and Development of HDI Multi-layer Laminated Copper Foil Production Technology

HDI多层板覆铜箔板生产技术的应用与开发

Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

GB/T12629-1990限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制板用)

epoxide woven glass fabric copper-clad laminates

环氧玻璃布基覆铜箔板

ployester woven glass fabric copper-clad laminates

聚酯玻璃布覆铜箔板

UV Blocking copper-clad laminates

紫外线阻挡型覆铜箔板

Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

GB/T16317-1996多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板

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