8Cu lead-free solder paste and flux, researched the reflow soldering technical conditions.
8Cu无铅焊锡膏及助焊剂的性能及原有回流焊接工艺进行分析总结,从回流工艺和助焊剂成分方面出发,针对存在的问题,进行优化,开发出一种性能优良的助焊剂。
This article introduces the process of solder paste technical printing,analyses the interrelated disfigurement in printing and cause,and puts forward the relevant solvent.
本文简述了锡膏印刷的工艺流程,分析印刷过程中造成的相关缺陷及其产生的原因,并提出了相应的解决方法。
The paper discusses the SMT process of solder paste printing for electronic product with high throughput and high-quality.
讨论了电子产品SMT制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。
And it mainly introduces parameters of solder paste and printing machines(especially the parameters related to scraper).
印刷锡膏是表面组装生产中的第一道工序,也是最关键的工序,在表面组装生产中60％～70％的焊接缺陷与锡膏的印刷有关。
The Pilot Preparation and Study on New Type Flux and Solder Paste;
新型助焊剂与焊锡膏的制备与研究初探
The Improvement and Performance Analysis of Sn-Ag-Cu Lead-Free Solder Paste;
Sn-Ag-Cu系无铅焊锡膏组成优化与性能研究
Application of Hydroxy-alkyl-amine to Lead-free Solder Paste
烷基羟基胺在无铅焊锡膏制备中的应用
The Improvement of the Solder Paste Performance and the Effect of Composition on It;
SMT无铅焊锡膏性能的改进及其组份对性能的影响
Pb-free solders ? Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。
Pb-free solders– Sn-Bi-Zn based with our own patent and their modification to fit for package applications.
无铅焊锡—锡铋锌系无铅焊锡，材料设计、发，焊料（球、膏）发等。
To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。
It will cause the paste oxidation and lose flux ratio balance if it is exposed for long-time.
锡膏与空气长时间接触后，会造成锡膏氧化、助焊剂比例成分失调。
The most obvious is the necessity for increased reflow temperature.
最明显的是，使用无铅锡膏必须提高回流焊温度。
It involves the considerations of alloy content, tin powder particle and soldering flux type.
选择锡膏要考虑的因素包括合金含量，锡粉颗粒和助焊剂的因型。
When the pad area is greater than66 percent of the aperture wall surface area, the probability of achieving efficient paste transfer is increased.
当焊盘面积大于孔壁表面积的66%提高锡膏有效转移的可能性。
The Study Based on Characteristics of Stencil Opening Hole in the Solder Paste Deposition Process;
基于模板特性影响焊膏印刷落锡量过程控制研究
The right choice of the most suitabele soldering paste is essential for an ideal and stable soldering result.
为了要达到理想又稳定的焊锡效果，选择合适的锡膏是决定性的因素。
All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program.
我们制造焊膏所使用的焊锡粉是在惰性气体和严格质量控制之下制成的。
Solder paste is applying for the connection between the mount components foot and PCB pads in the SMT assembly.
在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。
tin-lead 60-40 solder
锡铅60-40焊料
Casting tin-lead solders
GB/T8012-1987铸造锡铅焊料
Asahi Metals (HK) Ltd.
朝日焊锡制品有限公司