By applying hermetically sealed structure,modular design and cooling plate,it is be able to make the transmitter meet the need to work in the open air with good cooling characteristics.
全密封的结构设计、模块化的组件设计及冷板技术的应用,使得该发射机既满足了野外工作的要求,又具有良好的散热性能。
Some key issues on thermal management of active array,such as system implement technology,cooling plate technology,system reliability design,thermal simulation technology and thermal testing technology are discussed,proceeding with special demanding of cooling technology in solid-state phased array radar.
从相控阵雷达对冷却技术的特殊要求入手,介绍了相控阵雷达冷却系统的特点,对相控阵雷达有源阵面热控制的多项关键技术问题,如冷板技术、系统实现技术、系统可靠性和可维修性设计、热仿真技术、热参数测试技术等进行了论述,并对两部采用不同热控制形式的相控阵雷达冷却系统的实现过程进行了系统介绍,重点阐述了两种不同冷却方式在实现过程中的仿真分析、系统流程设计等。
A new type cold plate with jet impingement coohng was presented in this paper.
本文介绍了一种新型的冲击冷却型冷板,重点研究了冲击角对强化换热效果的影响以及对驻点位置的影响,并运用场协同理论分析了射流过程中强化换热的机理。
This application CAD technology, on APPLO work station, to the optimization of the geometrical parameters of fin in the core of cold plate is described.
应用ＣＡＤ技术，对冷板芯部翅片的几何参数做了优化设计，做出了翅片参数与热工性能的相关曲线，为实现优化设计、全面提高冷板热工性能提供依据。
The influnce of wall conduction on heat transfer cofficients in rectangular ducts is discussed, and the cooling of electronic equipments with cold plate structure is analyzed by this method.
采用对流－导热耦合数值解法对矩形通道的强迫冷却进行了分析，讨论了壁面导热对矩形通道中换热系数的影响，并用此方法对电子设备冷却中广泛使用的冷板结构进行分析，最后对分析与实验结果进行了比较。
Study of heat transfer performance of hold-over plate in hold-over plate refrigerated vehicle;
冷板冷藏车内冷板换热性能的研究
Numerical simulation of eutectic solution during freezing period in the hold-over plate;
冷板内共晶溶液冻结过程数值模拟
The mathematical model of hold-over plate during melting period was developed by using enthalpy method.
用焓法模型建立了冷板融冰过程的数学模型,采用控制容积法对方程进行离散化,并用三对角矩阵算法求解出各节点的焓值和温度,分析了冷板厚度和车内空气温度对冷板融冰过程的影响;结果表明,冷板中心融解缓慢,冷板厚度对融冰过程影响比车内空气的影响大,减少冷板厚度将大大减少融冰时间。
Te heat transfer characteristic of rectangular channel cold-plate in electronic devices is studied with experimental and numerical simulation methods.
采用实验和数值模拟的方法研究了电子设备冷却用矩形通道空芯冷板的换热特性。
Vacuum brazing process of water-cooling plate for heavy-duty computer elements;
大型计算机电子元件水冷板的真空钎焊工艺研究
Introduces the vacuum brazing process of water-cooling plate for heavy-duty computer s electronic elements, including such parameters as vacuum presure and temperature especially the main technical indices of the vacuum brazing furnace used.
介绍了大功率电子元件水冷板的真空钎焊方法,包括真空度,温度等工艺参数,以及真空钎焊炉的主要技术指标。
To deal with multi-heat-source and high-heat-flux heat transfer problem of array antennas, a heat pipe cold plate equipment is developed.
为了有效解决阵列行波管的多热源、高热流散热问题 ,研制了基于其安装空间尺寸的热管冷板散热装置。
A 2-dimension mathematic model was built for a heat pipe cold plate used in electronic equipments.
热管冷板是近年来在电子设备冷却中大量应用的重要冷却方式,其构造简单,无运动部分,工作可靠,重量轻,温差很小,是一种非常有前途的新型电子设备冷却技术,然而目前尚无这种型式热管冷板的理论资料,缺乏实验研究。
The structure and accumulating cold mechanism of the cooling plate are described.
阐述了蓄冷板的结构及其蓄冷工作机理，分析了蓄冷剂的性能、蓄冷剂融点的确定以及蓄冷量的确定，并介绍了蓄冷板在冷藏汽车上的应用效