The wafer-level testing plays an indispensable role and becomes an important step in the IC fabrication process.
综述了针对MEMS探卡不同的应用前景所提出的多种技术方案,特别介绍了传感技术国家重点实验室为满足IC圆片级测试的要求,针对管脚线排布型待测器件的新型过孔互连式悬臂梁芯片和针对管脚面排布型待测器件的Ni探针阵列结构的设计和制造。
Based on requirement analysis, an automatic measurement system of comprehensive performance for emulsion pump was designed and implemented.
在需求分析基础上设计并实现了乳化液泵综合性能自动测试系统,采用多种传感器自动采集产品运行过程中的动态性能数据,采用自动控制技术实现自动加载,采用虚拟仪器技术实现数据处理、分析和管理以及测试流程的自动化。
The method and principle of automatic measurement for fan pressure is introduced,which has been the basis of selecting sensor of fan pressure and establishing hardware terrace of automatic measurement system for fan pressure.
介绍了风压自动测试的原理和方法,并在此基础上选择了风压传感器,搭建了风压自动测试系统的硬件平台,基于虚拟仪器语言Lab-VIEW构建了测试系统软件平台。
Peripheral interface circuits are controlled by personal computer by a printer parallel interface, realizing channel′s automatic transformation, the voltage programmable control by binary code method, automatic measurement for voltage current characteristics curves of thermistors and its automatic data processing.
利用PC机通过RS 2 32C标准串行接口同智能万用表组成自动测试系统 ,通过并行打印接口控制外围接口电路 ,实现电压程序控制及通道自动转换 ,并实现了对热敏电阻伏安特性曲线的自动测试和自动数据处理 。
The RF Wafer Test Technology with SoC Tester
基于SoC测试系统的RF圆晶片测试技术
Mechanical Test Wafer- A silicon wafer used for testing purposes.
机械测试晶圆片-用于测试的晶圆片。
Process Test Wafer- A wafer that can be used for processes as well as area cleanliness.
加工测试晶圆片-用于区域清洁过程中的晶圆片。
Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.
原始测试晶圆片-还没有用于生产或其他流程中的晶圆片。
Particle Counting- Wafers that are used to test tools for particle contamination.
颗粒计算-用来测试晶圆片颗粒污染的测试工具。
Premium Wafer - A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.
测试晶圆片-影印过程中用于颗粒计算、测量溶解度和检测金属污染的晶圆片。
Premium Wafer- A wafer that can be used for particle counting, measuring pattern resolution in the photolithography process, and metal contamination monitoring.
测试晶圆片-影印过程中用于颗粒计算、量溶解度和检测金属污染的晶圆片。
Profilometer - A tool that is used for measuring surface topography.
表面形貌剂-一种用来测量晶圆片表面形貌的工具。
Ingot- A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
晶锭-由多晶或单晶形成的圆柱体，晶圆片由此切割而成。
Design of the transistor characteristic test system based on 51 MCU
基于51单片机的晶体管特性测试系统的设计
Bonded Wafers- Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。
Haze - A mass concentration of surface imperfections, often giving a hazy appearance to the wafer.
雾度-晶圆片表面大量的缺陷，常常表现为晶圆片表面呈雾状。
Notch- An indent on the edge of a wafer used for orientation purposes.
凹槽-晶圆片边缘上用于晶向定位的小凹槽。
Bonding Interface- The area where the bonding of two wafers occurs.
绑定面-两个晶圆片结合的接触区。
Primary Orientation Flat- The longest flat found on the wafer.
主定位边-晶圆片上最长的定位边。
Slip- A defect pattern of small ridges found on the surface of the wafer.
划伤-晶圆片表面上的小皱造成的缺陷。
Mound- A raised defect on the surface of a wafer measuring more than0.25 mm.
堆垛-晶圆片表面超过0.25毫米的缺陷。
Pit- A non-removable imperfection found on the surface of a wafer.
深坑-一种晶圆片表面无法消除的缺陷。