pan filler

基本解释装模机

网络释义

1)pan filler,装模机2)scale of installed capacity,装机规模3)stripper apparatus,脱模装置;揭模机4)two-operating position die-mounting mechanism,双工位装模机构5)flight-simulation equipment,飞机模拟装置6)clamp device,clamping device,clamping unit,clamp unit,clamping system,合模装置<注塑机>

用法和例句

The 4 Development Stages of Domestic Air-cooling Thermal Power Units and the Total Loading Capacity

我国火电空冷机组发展的4个阶段和装机规模

Reconfigurable Module Design Based on Enterprise Product Chain

包装机企业产品链规划的可重构模块方案设计

Assembly Modeling and Planning of the Die For Automatic Assembling Process

面向自动装配的冲模装配建模与规划

pilot cracking unit

小规模试验性裂化装置

Study on the Stochastic Programming Model of Ocean ShippingContainer Slot Allocation Problem Based on Revenue Management;

基于收益管理的海运集装箱舱位分配随机规划模型

Mathmatic Model and Working Space of Loading-unloading Robot Locus Plan

一种装卸机器人轨迹规划的数学模型和工作空间

Integrate Planni of the Assembling Line for Loaders and the Process Layout;

装载机装配线的整体规划及工艺布局

A fitting together of parts, as those in a machine.

装配规格构件的装配,如安装于机器上的

Research on the Assembly Process Planning Based on Solid Assembly Model;

基于实体装配模型的装配工艺规划的研究

But it is not expected to take off in user sites until network computers, which require smart-card authorization prior to log in, are more widely deployed.

但是在登录前需要智能卡认证的网络计算机大规模装备之前,不要指望智能卡能有广泛应用。

Study on the Planning and Modeling of the Fas

柔性装配系统的规划和建模方法研究

Research on the Customer's Acceptance of Costume Mass Customization;

服装大规模定制消费者接受度的研究

Research on Assembly Sequence Modeling and Planning for Collaborative Assembly;

面向协同的装配序列建模与规划研究

Large-scale production of recombinant adeno-associated virus(rAAV)

重组腺相关病毒规模化生物包装技术

RESEARCH OF PLM SYSTEM FOR MASS CUSTOMIZATION IN APPAREL INDUSTRY

服装业大规模定制的PLM系统研究

Parameter model of water-conducting device specification for indirect subsurface drip irrigation

间接地下滴灌导水装置规格参数模型

General code for construction and acceptance of chemical machinery installation

化工机器安装工程施工及验收规范(通用规定)

Comprehensive Comparison Between FC and CSP and Their Development Anticipation

倒装片封装与芯片规模封装的综合比较及其发展前景

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