This paper describes the current status and theme of mounting technology and density rise and low temperature solder connection in the future.
概述了安装技术的现状、课题和将来的密度提高和低温焊料连接。
A low temperature glass solder of ternary system with a stoichiometric composition PbO:ZnO:B 2O 3=58:18:24(%wt) has been developed for bonding pressure sensor chip to the glass substrate inside a covar package.
研制开发了一种用于压力传感器芯片与 1 0 1玻璃基座相封接的三元系结晶性低温玻璃焊料 ,其基本成份为 Pb O:Zn O:B2 O3 =58:1 8:2 4 (% wt)。