The formula of carboxy nitrile rubber copper foil adhesive was researched.
对羧基丁腈橡胶体系铜箔胶粘剂的配方进行了实验研究,测试了其剥离强度、耐浸焊性等,分析了影响橡胶体系铜箔胶粘剂性能的因素,结果表明:体系中羧基丁腈橡胶用量为40%,改性酚醛树脂为10%～15%,环氧树脂加入量为30%,改性BMI加入量为10%～20%,其胶粘剂综合性能最好。
The control of tension upon rolling-up in copper foil production;
铜箔生产的收卷张力控制
Adhesion of polypropylene film and copper foil;
聚丙烯薄膜与铜箔的粘接
Electroless nickel plating on PCB copper foil catalyzed by zinc solution;
锌溶液催化印制板铜箔化学镀镍
copper clad
包铜的，铜包的，敷铜箔的
Electrodeposited copper foil
GB/T5230-1995电解铜箔
Nickel and nickel silver foil
GB/T5190-1985镍及白铜箔
epoxide woven glass fabric copper-clad laminates
环氧玻璃布基覆铜箔板
ployester woven glass fabric copper-clad laminates
聚酯玻璃布覆铜箔板
Mitsui Copper Foil (Hong Kong) Co., Ltd.
三井铜箔(香港)有限公司
UV Blocking copper-clad laminates
紫外线阻挡型覆铜箔板
Furukawa Circuit Foil (Hong Kong) Co., Ltd.
古河铜箔(香港)有限公司
flexible copper-clad dielectric film
挠性覆铜箔绝缘薄膜
metal core copper-clad laminate
金属芯覆铜箔层压板
Research on High-performance Tin Phosphorus Bronze C5210 Copper
高性能锡磷青铜C5210铜箔研究
epoxide synthetic fiber fabric copper-clad laminates
环氧合成纤维布覆铜箔板
polyimide woven glass fabric copper-clad laminates
聚酰亚胺玻璃布覆铜箔板
"epoxide cellulose paper core, glass cloth surfaces copper-clad laminates"
环氧玻璃布纸复合覆铜箔板
teflon/fiber glass copper-clad laminates
聚四乙烯玻璃纤维覆铜箔板
copper foil laminate
铜箔叠层板-印制电路板的
epoxide non woven/woven glass reinforced copper-clad laminates
环氧玻璃布玻璃纤维复合覆铜箔板
TURBIDIMETRIC DETERMINATION OF MICROAMOUNTS OF CHLORIDE (AS AgCl) IN COPPER ELECTROPLATING SOLUTION
氯化银比浊法测定铜箔镀液中微量氯