bonding

基本解释粘合,键

网络释义

1)bonding,粘合;键2)bond,粘合剂;键3)Root-soil bond,根土粘合键4)adhesive bonding,粘结剂键合5)no-conglutination anodic bonding,无粘连键合6)thermal adhesion (bonding),热粘接(键合)

用法和例句

It was fabricated using pn junction self-stop etching combined with adhesive bonding,and only three masks were used during the process.

传感器采用pn结自停止腐蚀和粘结剂键合的方式制造,制造过程仅需三块掩模板。

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