Simulation & Analysis of a Hydrodynamic Model of Semiconductor Devices by a Finite Element Method;
半导体器件动力模型的有限元法仿真与分析
Research for incompetent sources of semiconductor devices which are not up to the standard in DPA;
半导体器件DPA不合格的根源研究
A Galerkin-MMOCAA scheme for a semiconductor device simulation behavior of a semiconductor device;
一类半导体器件模拟的Galerkin-MMOCAA方法
Accelerators simulation experiment on single event effects in semiconductor devices;
半导体器件单粒子效应的加速器模拟实验
In order to improve the forward conduction characteristics of silicon semiconductor devices, a comprehensive study of the influences of boron diffusion, phosphorous diffusion, doping concentration distribution in P~+-P region of sintered Al-Mo electrode and the minority carrier life on the forward conduction characteristics is performed.
为提高硅半导体器件的正向导电特性,文中对器件浓硼扩散、磷扩散和烧结铝电极后P~+-P区掺杂浓度分布、少子寿命等因素的影响进行了实验研究。
They have extensive application prospect in fields such as high brightness light emitting diodes,short wavelength laser diodes,high performance UV detector,and high temperature,high frequency,large power semiconductor devices.
GaN具有禁带宽度大、热导率高、电子饱和漂移速度大和介电常数小等特点,在高亮度发光二极管、短波长激光二极管、高性能紫外探测器和高温、高频、大功率半导体器件等领域有着广泛的应用前景。
Types,technical characteristics and applications of power semiconductor devices frequently used for locomotive and rolling stock now are presented.
介绍了目前在机车车辆变流器中常用的电力半导体器件的种类、技术特点及应用范围,着重阐述了电力半导体器件冷却技术、结构特点及其应用范围,对我国机车车辆变流器冷却技术的发展提出了一些观点。
All of various new power semiconductor devices use infegrati on technology from the microelectronics and have achieved power integration.
功率半导体器件主要用来控制能源和负载之间的能量流,使这种控制有很高的精度,特别快的控制时间和很小的耗散功率。
The over-heat of power semiconductors is the main reason causing the failure of power supply,so it is necessary to well process heat design to enhance the reliability of power supply.
功率半导体器件广泛应用于各种电源设备中。
fuse for protection of semiconductor device
保护半导体器件熔断器
Technological Fundamentals of Semiconductor Device
半导体器件工艺原理
metal-oxide-semiconductor device
金属－氧化物－半导体器件
semiconductor device parameter stability
半导体器件参数稳定性
Course Design of Semiconductor Devices
半导体器件课程设计
Physics of Semiconductor Devices
《半导体器件物理学》
" Heat sink of semiconductor devices--Heat sink, extruded shapes"
GB/T7423.2-1987半导体器件散热器型材散热器
Heat sink for power semiconductor device
GB/T8446.1-1987电力半导体器件用散热器
Heat sink of semiconductor devices--Generic specification
GB/T7423.1-1987半导体器件散热器通用技术条件
Simulation on Stable-state Thermal Resistance of Sinks for Power Semiconductor Devices using the ANSYS software
用ANSYS软件包模拟半导体器件散热器稳态热阻
Semiconductor devices-Sectional specification for discrete devices
GB/T12560-1990半导体器件分立器件分规范(可供认证用)
Electrotechnical terminology--Power semiconductor device
GB/T2900.32-1994电工术语电力半导体器件
complementary metal oxide semiconductor device
互补金属氧化物半导体器件
Gold wire for semiconductor devices lead bonding
GB/T8750-1997半导体器件键合金丝
Semiconductor devices--Part 6: Thyristors
GB/T15291-1994半导体器件第6部分晶闸管
enhancement MOS device
增强型金属氧化物半导体器件
Rating systems for electronic tubes and semiconductor devices
GB/T5839-1986电子管和半导体器件额定值制
Power Supply Miniaturization and Application of Semiconductor Devices
电源的小型化与半导体器件的应用