TFI Thick Film Integrated

基本解释复合薄膜集成电路

网络释义

1)TFI Thick Film Integrated,复合薄膜集成电路2)thin-film hybrid integrated circuit,薄膜混合集成电路3)completely-integrated thin film circuit,全集成薄膜电路4)Thick & Thin Film Integrated Circuit,厚薄膜集成电路5)thin-film integrated circuit,薄膜集成电路6)film integrated circuit,膜集成电路,薄膜集成电路

用法和例句

Alumina ceramic substrates for thin film integrated circuits

GB/T14620-1993薄膜集成电路用氧化铝陶瓷基片

circuit, integrated hybrid, thin or thick film

混合集成电路,薄膜或厚膜的

Study of MOCVD TiN in Advanced Semiconductor Manufacturing;

MOCVD TiN薄膜在先进集成电路制造中应用的研究

High Voltage PDP Data Driver IC Based on Thin Layer SOI

基于薄膜SOI的PDP高压寻址驱动集成电路

Research on the Fabrication of High-k Dielectric Films and the Discussion of Integrated Thin Film Capacitor;

高k电介质薄膜制备研究与集成薄膜电容探讨

circuit, thin or thick film, consisting solely of passive elements

薄膜或厚膜电路,仅由无源元件组成

The Morphological Evolution for a Void in Thin-film Interconnect of Integrated Circuit Analyzed by Phase-field Method

集成电路薄膜导线中孔洞形貌演化的相场法研究

Research of WN film as diffusion barrier layer in ULSI-Cu metallization

集成电路亚45nm级铜布线扩散阻挡层WN薄膜的研究

passive hybrid film integrated circuit

无源混合膜集成电路

film mounted ic

膜载组装的集成电路

Generic specification for film integrated circuits and hybrid film integrated circuits

GB/T8976-1996膜集成电路和混合膜集成电路总规范

A new technique for fabricating EMIF in thin film IC based on superfine processing technique is proposed.

提出一种基于集成电路超微细加工技术制造电磁干扰滤波器的薄膜集成制造新技术。

Case outlines for film integrated circuits and hybrid integrated circuits

GB/T15138-1994膜集成电路和混合集成电路外形尺寸

Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure

GB/T13062-1991膜集成电路和混合膜集成电路空白详细规范(可供认证用)

Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

GB/T16465-1996膜集成电路和混合膜集成电路分规范(采用能力批准程序)

The preparation and properties of the dielectric/semiconductor functional integrated thin films

介电/半导体功能集成薄膜的制备和特性调控

The Reliability-Analysis for HIC and Its Improvement;

厚膜混合集成电路可靠性分析与提高

Important Technique Problems in Silk Screen Printing for Thick Film Integrated Circuits

厚膜集成电路网印应注意的技术问题

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