Research on parameter optimization of chipset for high performance computing;
面向高性能计算的芯片组参数优化研究
Design and implementation of multi-processor chipset based on Godson 2E CPU;
龙芯2E多处理器芯片组的设计与实现
Design and Implementation of FPGA Hardware Emulation Platform and MIPS Chipset;
FPGA硬件仿真平台和MIPS芯片组的设计与实现
Tissue microarray expression of phosphoinositide 3-kinase regulatory subunit p85α,AKT2 and Ki-67 in ovarian cancer;
卵巢癌组织芯片中磷脂酰肌醇3激酶调节亚基p85α,AKT2及Ki-67表达
Expression and clinical significance of protein-serine-threonine kinase 2 protein in human colorectal carcinoma using tissue microarray;
利用组织芯片技术研究丝氨酸/苏氨酸蛋白激酶2在大肠癌中的表达及其临床意义
Biological significance of expression of calcyclin in human pancreatic carcinoma: a tissue microarray-based study;
应用组织芯片技术研究人类胰腺癌中钙结合蛋白表达的生物学意义
Detection of Skp2 and p27~(kip1) expression in human renal cell carcinoma using tissue chip technique;
应用组织芯片技术研究Skp2、p27~kip1在肾细胞癌中的表达及意义
By using tissue chip technique to analysis the expression of Ubiquitin,Skp2 and p27 in lung cancer;
采用组织芯片技术检测肺癌中泛素、Skp2、p27的表达
Study on the expression of Ubiquitin,CyclinE and P27 in breast cancer by using tissue chip technique;
采用组织芯片技术检测乳腺癌中泛素、cyclinE和p27的表达
Preparation of tissue array and applications of in situ analysis technology;
组织芯片制备与原位分析技术
Methods Paraffin-embedded materials in 219 cases of lymphoma and 13 reactive proliferation lymph nodes were made up a tissue array.
方法 石蜡标本制作组织芯片,应用免疫组化S P法检测219例淋巴瘤及13例反应性增生淋巴结石蜡标本中survivin和bcl 2表达;同时应用RT PCR技术检测18例淋巴瘤、2例淋巴结反应性增生survivin和bcl- 2mRNA表达,并进行半定量分析。
Methods The expression of uPA and uPAR in hepatoma were tested by using the S-P immunohistochemistry and tissue array.
方法通过组织芯片及免疫组化法测定HCC癌组织中uPA及其受体(uPAR)的表达,并与肝硬化及正常肝组织比较。
Expression of TIMP-1 and TIMP-2 in Breast Cancer as Determined by Microarray and the Relation to Prognosis;
利用组织芯片方法探讨乳腺癌组织中TIMP-1 TIMP-2表达及预后意义
The Application of Microarray Immunohistochemical Technique in the Detection of the Index Correlated with Breast Cancer;
组织芯片技术在乳腺癌相关指标检测中的应用
Methods: Tissue microarray and immunohistochemical SP method were used to detect the expression of MMP-13 in 183 specimens of breast cancer.
方法:采用组织芯片及免疫组化SP法检测了183例乳腺癌组织中MMP-13的表达水平,分析乳腺癌组织中MMP-13的表达情况与临床病理因素之间的相关性,并结合完整的10年随访资料探讨MMP-13与乳腺癌预后的关系。
This paper introduces the single chip processor control system composed of PS0001 chip-group,TLC2543 chip and LCD with large screen,which shows the powerful function of this control system.
通过对由PS0001芯片组、TLC2543模入芯片及大尺寸液晶显示屏组成的单片机控制系统的介绍,展示了该控制系统的强大功能。
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model
基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
High performance SDH/SONET chip group
高性能同步数字传输光纤网络芯片组
A System-Level Functional Verification Platform for the Dawning 5000 Chipset
曙光5000芯片组系统级功能验证平台
Analysis of the Interconnect in Microwave Multi-chip Module by Parallel FDTD Technique;
并行FDTD技术分析微波多芯片组件的互连效应
Construct cell immuno-chip with tissue microarray technique
应用组织芯片技术构建细胞免疫芯片
Studies of Metastasis-related Mechanisms of Gastrointestinal Cancer Based on TMA and Gene-chip;
利用组织芯片和基因芯片研究胃及大肠癌转移机制
Identification of Differentially Expressed Genes in the Development and Progression of Human Hepatocellular Carcinoma by cDNA and Tissue Microarray Techniques;
基因芯片联合组织芯片探讨原发性肝癌发生发展的分子机制
Analysis of Temporal Transcription Program of HearNPV by Microarray;
基因芯片检测HearNPV基因组转录谱
Prospective Application of Tissue Microarray in pathology Course;
组织芯片在病理学教学中的应用前景
The Study of Expression of Argonaute Family Proteins in the Tissue Microarray of Gastric Carcinoma
胃癌组织芯片中Argonaute家族蛋白表达研究
The Role of Expression of HIF-1α mRNA in Lung Carcinoma on Tissue Microarray
HIF-1α mRNA在肺癌组织芯片中的表达意义
DNA Extraction from Activated Sludge for Metagenomic Array
活性污泥宏基因组芯片DNA的制备方法
Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究
Development and application of HT-1 tissue microarrayer
HT-1型组织芯片仪的研制和应用
Design of Li-ion battery charger based on single chip
基于单芯片的锂电池/组充电器设计
super chip
高密度芯片,超级芯片
The new chips will not have four cores on a single slice of silicon, but instead consist of two dual-core chips stuck together.
新的芯片将不会在单个硅片上安装四个内核，而是包含两个了2个组合在一起的双核芯片。
From laptops to lasers, from microchips to megabytes,
从笔记本电脑到激光，从微芯片到百万位元组，