The design method and the system fabrication process of 8mm integrated chip receiver with MCM-D are introduced.
介绍了用MCM D技术研制的 8mm芯片集成接收机的设计方法及系统实现 。
With the increase of chip integration level and packaging density,the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高,计算机发热密度近年来一直呈指数级增长。