Solder beading is one of the most usually solder defects in printing circuit board assemblly,In this paper,we will analyse the reasons of forming solder beading.
本文针对印制电路板板级装配中普遍存在的锡珠缺陷,进行了缺陷的原因分析,并从模板制作和焊接温度曲线这两个最易导致锡珠出现的工艺环节出发通过试验找到一种可较好的消除锡珠的模板开口形状和焊接温度曲线形式。