Measurements of release sound velocities of tin with reverse-impact method;
反向碰撞法测量Sn的高压卸载声速
The oxidation behviours of liquid tin with and without trace Ge at 250℃in atmo- sphere were studied by both observation and removing dross from the surface periodically.
采用观察液态Sn表面氧化行为和刮取表面氧化渣的方法,研究了微量元素Ge对液态Sn在大气和250℃条件下表面抗氧化性能的影响,并与纯Sn的氧化行为进行对比;利用X射线光电子能谱仪(XPS)、扫描电子显微镜(SEM)研究了合金表面元素的含量、价态,及合金氧化后的表面形貌。
Based on Atomic and Molecular Reaction Statics and Group theory, the basis sets SDD~(**) for Tin and 6-311g~(**) for H_2, and density functional (B3P86) method have been used to calculate energy E, heat capacity C_v, entropy S of hydrogen isotopes and their Tin compounds.
根据原子分子反应静力学与群论,确定了H2、D2和T2的基电子状态为1∑+g(D∞v),SnH、SnD和SnT的基电子状态为2∑+(C∞v)。
The Summary of Measuring Method on the Heavy Metal,Sn;
重金属锡的测定方法综述
Simultaneous Determination of Ge and Sn by Artificial Neural Network Spectrophotometry;
人工神经网络光度法同时测定锗、锡
Systematic Analysis Method for Determination of Al,Zn,Si,Fe,Pb,Cd,Sn in Hot Zincification Alloy with High aluminium;
高铝热镀锌合金中铝锌硅铁铅镉锡的系统分析方法
Advances in Tin Distribution between Granitic Melts and Coexisting Aqueous Fluids and a Review of Tin in Fluids and Melts;
锡在花岗质熔体和流体中的性质及分配行为研究进展
Analysis of the Operation Condition's Effect on the Tin Reverberatory Smelting Thermodynamics Process;
操作条件对锡反射炉熔炼热力学过程的影响分析
Atomic Fluorescence Spectrometric Determination of Inorganic Tin in Environmental Water After its Enrichment with Chitosan;
壳聚糖富集分离原子荧光光谱法测定环境水样中无机锡
The Study of Sn-Ag and Sn-Zn Multi-Composition System Lead-Free Solder Alloys;
Sn-Ag和Sn-Zn系多组元无铅软钎料研究
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
Aging Characteristics of Pd-Ag-Sn-In-Zn Alloy
Pd-Ag-Sn-In-Zn合金时效特性
Effect of Sn on the Microstructure and Properties of Ti-Zr-Nb-Sn Alloy System;
Sn元素对Ti-Zr-Nb-Sn合金系组织和性能的影响
Catalytic Synthesis of Diphenyl Carbonate by Transesterification Ove Supported Sn on TiO_2 and Inorganic Sn;
TiO_2负载Sn及无机Sn催化酯交换合成碳酸二苯酯
Effects of Sn content on the anticorrosion property of Ni-Sn-P alloy plating
Sn含量对Ni-Sn-P合金镀层耐腐蚀性能的影响
Effect of Sn content on microstructure and phase structure of TiNbSn alloy
Sn含量对Ti-Nb-Sn合金组织及相结构的影响
CROSS SECTION CHANGING GROWTH PHENOMENON OF Sn WHISKER IN Sn-3.8Ag-0.7Cu-1.0Er LEAD-FREE SOLDER
Sn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象
The Reversibility of Liquid-liquid Structural Change of Pb-Sn、In-Sn and Pb-Bi Alloys;
温度诱导Pb-Sn、In-Sn和Pb-Bi合金液—液结构转变的可逆性
Rapid Growth of Pb-Sb-Sn and Pb-Sn-Zn Ternary Eutectics under Substantial Undercooling Conditions;
深过冷条件下Pb-Sb-Sn和Pb-Sn-Zn三元共晶的生长规律研究
The Effect of Melt Structure Transition on the Solidification of Binary Sn-Bi and Sn-Sb Alloys
熔体结构转变对二元Sn-Bi和Sn-Sb合金凝固的影响
A Study on Hypoeutectic Sn-Zn Alloys as Lead-free Solders;
亚共晶Sn-Zn合金无铅电子焊料研究
Aluminum Alloy Soldering Procedure Research Based on the Sn-Pb-Zn Solder;
基于Sn-Pb-Zn钎料铝合金钎焊工艺研究
A Study of the Creep Property of Sn-9Zn Solder and Its Strengthen;
Sn-9Zn钎料蠕变性能及其复合增强研究
Study on the Non-eutectic Sn-Bi Solders with Low Melting Point;
Sn-Bi系低熔点非共晶无铅焊料的研究
A Study on Surface Bioactivity of NiTi and Ti-Nb-Sn Alloys;
NiTi及Ti-Nb-Sn合金表面生物活性化研究
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究