Design and development of temperature control system based on PC/104 platform for PE pipe fusion machine
基于PC/104的热熔焊接机温度控制系统的研制
Design of butt-fusion welding machine controller based on ARM
基于ARM嵌入式热熔焊接机智能控制器的设计
Modeling of Heat Conduction in Thermoplastic Honeycomb Core/Face Sheet Fusion Bonding
热塑性蜂窝面/芯热熔焊接过程中的热传导模型计算(英文)
Design and Implementation of the Control System of Automatic Butt-Fusion Welding Machine for PE Pipes;
全自动塑料管材热熔焊接机嵌入式控制系统的设计与实现
The Discuss of PE Pipe-Melting Application to Jointing Technology;
论PE管热熔对焊接施工技术的应用
Development of Inductive Heater in Butt-fusion Welding Machine for Pressurized Plastic Pipes;
塑料压力管道热熔对接焊机感应加热板的研制
electric brazing machine and apparatus (excl. furnaces, ovens and heating equipment)
电硬焊机器和设备（熔炉, 烘炉和加热设备除外）
Internal defects:lack of penetration,lack of fusion,slag,gas pole,carck,overheating.
内部缺陷：未焊透、未熔合、夹渣、气孔、裂纹、过热。
Numerical Simulation of Temperature Field in Laser Deep Penetration Welding for Aluminum Alloys;
铝合金激光深熔焊热过程数值模拟研究
Analysis of Droplet Transfer Behavior in CO_2 Laser-MIG Hybrid Welding Process;
CO_2激光-MIG复合热源焊接熔滴过渡的行为分析
Study on the Interfacial Reaction and Reliablity of Solder Bumps Reflowed by Induction Heating
感应加热重熔焊点界面反应及可靠性研究
Numerical Simulation of Phase-Transition Heat Transfer and Fluid Dynamic Characteristic in Welding Pool
焊接熔池相变传热特性及流体动力学分析
Simulation of the keyhole formation during deep penetration welding using an adaptive heat source model
用自适应热源模型模拟深熔焊小孔的形成过程
Finite Element Numerical Simulation of Temperature Field in Deep Penetration Laser Welding for Aluminum Alloys
铝合金激光深熔焊接热过程有限元数值模拟
Fusion-brazing Joining for Dissimilar Metals Between 5A02 Aluminium Alloy and Zinc-coated Steel Based on Laser-MIG Hybrid Welding
基于激光——MIG复合热源的5A02铝合金/镀锌钢熔——钎焊
MEASUREMENT OF MOLTEN POOL TEMPERATURE FIELD DISTRIBUTION USING INFRARED TECHNIQUE IN VERTICAL - DOWN SMAW
立向下焊焊接熔池表面温度场分布的红外热象法测定
The melting welding would result in the thermal crack and cannot be used to bond the big and bended parts due to the low welding depth.
铍的熔化焊由于热影响区对热特别敏感及焊接裂纹等而存在很大困难。
The board and chip are then heated to melt the solder and join the two together.
然后加热面板和芯片的缝合处，使焊锡熔化，从而把二者粘在一起。