Taking copper cladding steel(CS) wire produced by means of hot dipping method as an investigation,the influences of process parameters,such as surface preparation method,preheating temperature,liquid copper temperature and bonding time on the bonding strength of Cu/Fe were studied systematically.
以热浸镀法生产的铜包钢线为研究对象,研究了预热温度、铜液温度和复合时间等工艺参数对铜包钢线界面结合强度的影响;测定了不同包覆比的铜包钢线的电导率。
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐,加入络合剂、光亮剂、锡盐稳定剂,研究成功了一种新的浸镀铜锡合金工艺。
Use immersion plating to plate film on the glass.
以硝酸镍为起始原料,采用溶胶-凝胶法制得高稳定性的溶胶体系,用浸镀法在玻璃表面镀膜,研究了不同物质配比对溶胶稳定性和成膜性的影响,利用DTA、IR、XRD分析了凝胶和薄膜的结构,确定了氧化镍薄膜的制备条件;溶胶制备温度为60～80℃,pH=4,镀膜热处理温度为300～350℃,时间2h。
In this paper, the characteristic, electrochemistry principle and technological controls of immersion plating depositions were reviewed, which are keen surface technology in electronic field.
本文介绍了当前电子行业热门的表面技术-浸镀处理的特点、机理及其工艺控制。
On the microstructure of immersion silver on sputtered copper;
溅射铜基材上浸镀银的微结构表征(英文)
Research on the material of hot dipping pot for 55% Al-Zn alloy layer;
应用于热浸镀55%铝锌合金锅体材料的研究
This paper dealt with some of hot dipping 55%Al-Zn fluxes for un-hardened and tempered N80 steel.
研究了石油管常用材质非调质N80钢热浸镀55%Al-Zn合金的助镀工艺,确定了最佳助镀方法为电解活化加浸4%K2ZrF6水溶液的助镀法。