Melting characteristic of twin electrode single arc weldingII.Self-regulating effect of arc on two cores melting;
双电极焊条单弧焊的熔化特性 Ⅱ.电弧对两焊芯熔化的自调节作用
For improving process control and quality assurance capabilities of flip chip packaging, inspection is required.
介绍了倒装焊芯片生产工艺及其质量控制中所需检测的项目,并分类综述了其中所涉及的光学检测、X射线检测、声学检测等几种非接触检测方法的基本原理和步骤,这些方法对于微纳米制造中微结构性能测试和缺陷检测具有同样重要的意义。