Effect of voids on the reliability of EBGA solder joints under thermal cycle;
热循环加载条件下空洞对EBGA焊点可靠性的影响
Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP;
温度循环应力剖面对QFP焊点热疲劳寿命的影响
Shape prediction and reliability analysis of QFP solder joint;
QFP焊点形态预测及可靠性分析
Optimum simulation and prediction on thermal fatigue life of soldered joints of QFP devices;
QFP组件的优化模拟及焊点热疲劳寿命的预测
Effect of CPGA gull wing lead size on reliability of soldered joints;
引线尺寸对CPGA翼形引线焊点可靠性的影响
Investigation for SnAgCu/Cu and SnAgCu/Au/Ni/Cu surface mounted soldered joints stored at high temperature;
SnAgCu/Cu和SnAgCu/Au/Ni/Cu表面贴装元件焊点高温存贮试验分析
Put forward the features of spot weld in assembling welding and are pointed out and the mechanism of spot welding is analyzed in detail.
介绍微波组件的应用及其组装焊接的重要性,提出组装焊接中焊点的特点,并对焊点失效进行详细机理分析,阐述机械应力和热应力对焊点失效的影响,在焊接工艺和焊点设计方面找到抗失效断裂的有效措施,从而保证焊点的质量,提高微波组件的可靠性。
And the draws of the stress, the whole life and the spot weld life of the crossmember are got after the analysis.
应用有限元分析法对副车架的疲劳台架试验进行强度和疲劳分析,得到副车架的应力分布图、副车架本体寿命云图和焊点寿命云图。
In situ observation and research on electrochemical migration of SnAgCu solder joints;
SnAgCu钎料焊点电化学迁移的原位观察和研究
The microstructure and thermal fatigue behaviour of 62Sn--36Ph--2Ag solder joints;
62Sn-36Pb-2Ag焊点组织及热疲劳裂纹的萌生与扩展
Image preprocessing of solder joints by X-ray;
基于X射线的焊点图像预处理方法及应用
Effects of solder joint shape on joint reliability in SMT;
SMT中焊点形状对焊点可靠性的影响